Date: Aug 16, 2018

Location: MA, US

Company: MIT Lincoln Laboratory

Requisition ID: 23602 

 

Group 77—Rapid Prototyping
The Rapid Prototyping Group focuses on partnering with groups across the Laboratory to execute rapid prototyping efforts. The group works on diverse programs, delivering new advanced technology capabilities in timelines typically under a year. This group leads and coordinates various activities: mechanical system design and fabrication, electronics system design and fabrication, system engineering, integration into aircraft and other platforms, and laboratory and field testing. Projects are conducted in a team environment, utilizing resources from both the Engineering Division and mission area groups to successfully execute fast-paced development and demonstration efforts.

Description:
The Rapid Prototyping Group seeks an engineer with experience in the design, fabrication, and integration of RF systems.  The engineer will work on a variety of short duration (6-18 month) projects while interfacing directly with subject-matter-experts from across the Laboratory to design and implement state-of-the-art RF systems.  Experience in the electrical design and fabrication of RF printed circuit boards, antennas, and RF chassis for a variety of platforms (unmanned and manned vehicles, aircraft, ships, spacecrafts, etc.) is highly desirable.

Must be able to work collaboratively in a multi-disciplinary team environment and demonstrate good written and oral communication skills. 

 

Skills:
- Experience with electrical printed circuit board schematic capture and layout tools such as Mentor Graphics DxDesigner and Expedition for RF designs up to 12GHz is required

- Experience with electromagnetic modeling and analysis software such as Ansys HFSS, Feko, CST, Agilent ADS, Microwave Office, or equivalent software is highly desired

- Experience with embedded electronics hardware and software is highly desired (FPGA programming, C++ software development, PC board and cable design/fabrication)

- Experience with hardware testing and debugging is required

- Work history that includes hands-on systems integration and strong desire to build things is required
- Experience with the design of sensor systems for defense applications (radars, communications systems, RF devices) is desired
- Experience with the various printed RF circuit board materials and embedded passives is required
- Familiarity with thermal analysis and structural analysis is desired


Qualifications:
MS in Engineering with 3-5 years of work experience or a PhD in Engineering

Must be able to obtain and maintain a security clearance

MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.


Job Segment: Engineer, Thermal Engineering, Electrical, Electronics Engineer, Electrical Engineering, Engineering

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