Job Description

• Evaluating and selecting suitable materials, composition and doping profiles, and process steps to achieve desired device specifications, manufacturability, and yield
• Collaborating closely with process engineers to define and refine process flows, experiment planning, execution, and analysis of results
• Developing novel device and circuit elements motivated by mission and system requirements 
• Planning and overseeing device packaging and electrical testing (DC, CV, RF, and high voltage, etc.), thermal, and reliability characterization of fabricated devices, analyzing test data to validate models, extracting key device parameters, and identifying areas for optimization
• Investigating device failures using advanced microscopy and spectroscopy (SEM, TEM, FIB, EDX, etc.), root-cause analysis, and simulation
• Working with multidisciplinary teams (process engineering, test, characterization, packaging) to define objectives, plan development and integration strategies, manage execution, analyze data, and document experimental progress
• Supporting external engagement and communication with project sponsors for technology transfer, as needed.
• Participating in IP development, publications, and external technical collaborations as needed; and briefing diverse internal and external audiences (non-experts, sponsors and senior leadership)
• Contributing to strategic planning by creating technology roadmaps, and identifying new applications, opportunities, and partners for technology transfers

Required Qualifications

• PhD (or equivalent experience) in Electrical Engineering, Mechanical Engineering, Materials Science and Engineering or similar fields of study. Equivalent experience will be considered.
• Thorough understanding of ultra-wide band gap semiconductors, (e.g., SiC, GaN, Diamond, etc.)  semiconductor device (e.g. MOSFETs, IGBTs, BJTs, HEMTs, etc.) physics, materials growth, fabrication, and characterization for power and / or radio frequency applications
• Hands-on experience with electronic device packaging, microfabrication process development lithography, metal and dielectric deposition, etching, wafer dicing), process integration, metrology, electrical characterization, and failure analysis.
• Experience working in a semiconductor, MEMS, or other microfabrication clean room settings
• Experience with design of experiments, statistical methods and their related tools (e.g., JMP), statistical analysis and data-driven problem solving
• Experience with device test and characterization (on-wafer automated DC/CV/AC, RF, etc.), data and analysis acquisition, and/or programming (MATLAB, Python, LabView)
• Demonstrated track record of technical success, impact, and innovation
• Demonstrated technical team leadership and/or project management
• Excellent communication skills with the ability to collaborate effectively across disciplines, all levels of the organization and with external partners and sponsors
• Experience engaging with sponsors and stakeholders to translate application needs into device requirements
• Ability to work independently and as part of cross-functional teams

Preferred Qualifications

• Familiarity with processes and procedures for process technology transfers

• Familiarity with power conversion topologies such as buck, boost, and inverter circuits

• Familiarity with RF test circuit elements such as transmission lines, small signal RF, load-pull
• Familiarity with the applications pertaining to commercial and defense interests that use ultra-wide band gap semiconductor devices

Familiarity with device and process simulation tools (e.g., Synopsys, Silvaco), finite element modelling (COMSOL), and / or compact models generation