Microfabrication Engineer- Compound Semiconductor Devices

Apply now »

Date: Jul 11, 2018

Location: MA, US

Company: MIT Lincoln Laboratory

The Advanced Imager Technology Group performs research and development of imager devices and subsystem-level technology for the DoD and scientific community. The imager efforts include advanced silicon, germanium, and compound semiconductor based focal-plane technologies for applications such as ground- and space-based surveillance, adaptive optics, and astronomy. These focal planes address special requirements, for example, large-format gigapixel arrays, very high-speed imagers (exposure intervals from microseconds to 100 ps), time-of-arrival detectors (LADAR receiver), and single-photon and high sensitivity detectors for low-light-level imaging applications. The Group's efforts span the range of device and materials development, integrated circuit design and fabrication, custom packaging, detector hybridization, and the development of control and readout electronics for system-level demonstrations.


The Advanced Imager Technology Group is seeking to hire an Assistant Staff member with broad responsibilities in the fabrication of compound semiconductor devices.  Specifically, the candidate will be the principal engineer responsible for the fabrication of compound semiconductor (III-V) photodetector arrays.  The engineer will lead the fabrication effort as well as develop new processing techniques to produce novel detectors.  Candidate will work closely with team members to select and modify process steps/tools and generate new ideas to improve photolithography, etching and deposition processes. As team leader, the candidate will actively manage and transfer processes to technicians, while monitoring status of work-in-progress and the work load of technicians.


Requirements: B. S. Degree in Electrical Engineering or Physics.  Experience with hands-on microfabrication techniques, such as photolithography and etching, is required.  Previous fabrication experience with compound semiconductor materials and devices is preferred.   Must be able to work effectively in a team environment and to train technicians.  Candidate must be able to manage multiple projects and meet deadlines amidst changing requirements, and priorities.

Find similar jobs: